Forum

Hi there!

A few things that I would like to know:

1. Earlier this year I ordered a Prototype board. Most of the pads in that board had hole (drill) size of 0.8mm. When the board arrived I noticed that all 0.8mm holes were ?converted? to 1.0mm. All other hole sizes were just like in the file (originally 1.0mm was 1.0mm etc.). I checked my GWK-file and it was correct. This is a real problem because 0.8mm is perfect for manual assembly for most components (they dont stay in place in 1.0mm holes when soldering). Fortunately there was only one board and it was quite small (still assembly took a lot of extra time). Can You tell me what could be the reason and how can I be sure that this does not happen again?

2. Do copper-fills cause problems in Your tin-coating process? I mean a solid fill (like RF-boards) not a cross-hatch. (For example bottomside is normal signal-layer and topside has a solid (ground) fill and only few signal tracks.)

Please answer both questions.

vp

Hello Mr. Palomaki,
to 1:
If you specify a 0.8mm drill, than you must get
a 0.8mm drill. So I can only imagine, that this
was a CAM-Operator mistake, made while combining the different drill sizes. Send us an email with the corresponding Jobnumber and you get new pcbs for free.

to 2:
A different copper area from one side to the other side will make no difference. If you are talking about pcbs without soldermask, then it can only happen, that a crosshatch with small gaps is "filled" with tin.

We hope we could answer your question.

All the best
Your Beta LAYOUT Team