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Dear PCB pool team,

I am doing some pre-layout simulation with LineeSim. Once it is done PCB will be order using the "PCBpool Layer Build ML4" reference. Right now I am creating the stackup model for the ML4.

On your specification page there are "material construction" and "layer buildML4" specs.
For material construction I can see:
1. Soldermask 10 - 30 µm / each side
2. Plating Tin on Pads 10 - 15 µm HAL / 0,07µm ± 0,01 µm Chem. Ni/Au
3. Copper 30 - 50 µm / each side
4. Tin in Barrel 3 - 9 µm HAL / Chem. NiAu
5. Copper in Barrel 16 - 23 µm
For layer ML4 I can see:
Layer 1/Layer4; Copper foil 18 µm; Thickness after galvanic plating 35 µm

I am probably misinterpreting those 2 sections as at the first look the number for copper and plating do noty seem to match.
Could you please clarify what is the:
- copper thickness for the pads/traces on layer 1/layer4? Is it 18um (from ML4 spec)or between 30 and 50 um (from material construction)?
- plating thickness for the pads/traces on layer 1/layer4? Is it 17um (ie 35 - 18) or between 10 to 15 um?

- Do you have tips for parameters to use for modeling the board stackup (for example: In term of tolerance should the highest/lowest/average thickness be used?, ..etc)?

Thanks in advancea and best regards,
Anthony

Hi Anthony

The Basic- Copper on both sides will be 18µm. The Process "Electroplated conductor configuration" put add. copper on to pads and tracks. The End- thickness will be 30-50µm.
The copperfoil in the innerlayers are unmodified - so it will be 35µm for each innerlayer.

Your PCB-POOL Service Team

Thanks a lot!

What is dielectric cheracteristic (Er) of the laminate core/prepeg that is used?
Do you give the exact reference of the Lamintate used (like Isola 370HR, Nelco N4000-29, ..etc)?

Thanks in advance,
Anthony

Hi Anthony

All the required informations you will find here: http://www.pcb-specification.com/images/stories/Datenblatt/DE104ML_3_english.pdf

The used Prepregtype is the same as in the picture we uploaded.

Your PCB-POOL Service Team